PTI-G3801 is Silicon-base thermal grease with excellent heat-conductive filler and effective thermal grease for any heat sink device where efficient cooling is required, such as CPU power transistor, and SCRs to heat sink or chassis. It will not dry out, harden, or melt even after long term exposure to temperatures up to 240 degrees.

PTI-G3801 is Silicon-base thermal grease with excellent heat-conductive filler and effective thermal grease for any heat sink device where efficient cooling is required, such as CPU power transistor, and SCRs to heat sink or chassis. It will not dry out, harden, or melt even after long term exposure to temperatures up to 240 degrees.

Overview:
Silicon-base thermal grease, PTI-G3801 is optimized to provide heat transferring efficiently and reliably from CPU to heat-sink, and not to cause electrically conductive problems while contacting the pins of an IC.
Outperform to standard thermal compounds 4 to 10 degrees lower CPU full load core temperature.
In syringe and brush attached enables easy application and prevents unnecessary waste.

Features:
Extended Temperature limits: Peak: -50 C to 240 C
The high-density, specifically designed for modern high-power
CPUs and high-performance heat-sinks or water-cooling solutions.
Silicon-based thermal grease has moderate thermal conductivity.
Not electrically conductive, can't cause problems if it contacts the pins of an IC.
High thermal conductivity > 3.8 W/m-K.
At a layer 0.003"thick, one tube will cover approximately 300 square inches.

Specifications:
Product Name: PTI-G3801
Product Number: CXT-USGI3-U01
Color: Grey
Thermal Conductivity: >3.8 W/m-k
Thermal Impedance at 25 C: <0.087 C-in2/W
Specific Gravity at 25 C: >2.5
Evaporation 200 C/24hours: <0.001 %
Bleed 200 C/24hours: <0.05 %
Dielectric Constant A at 100Hz: >5.1
Dissipation Factor A at 100Hz: <0.005
Viscosity at 25 C: 76 CPS
Capacity: 3 gram
Operation Temperature: -50~240 C
Application: All system or CPU cooler